3300/03-01-00 Bently Nevada System Monitor with Serial Data Interface SDI Module

3300/03-01-00 Serial Data Interface and Dynamic Data Interface
3300/03-01-00 Serial Data Interface and Dynamic Data Interface
3300/03-01-00 Serial Data Interface and Dynamic Data Interface

General Information

 Model number  3300/03-01-00
 Country of origin  USA
 Condition   Brand New
 Dimension  20.3x5.1x33cm
 Weight  0.44kg
 Lead time Warranty  in stock
 MOQ  1 pcs

 


Core Description

Designed to bridge localized machinery protection hardware with plant-wide supervisory control networks, the 3300/03-01-00 is a Bently Nevada 3300/03 chassis-resident system monitor equipped exclusively with a Serial Data Interface (SDI) communications processor. It continuously steps through and multiplexes static parameters and alarm states directly from localized rack monitors every 5 seconds. This slot-specific interface module translates internal rack variables into industry-standard protocol maps over RS-232 or RS-422 networks, delivering reliable supervisory monitoring without interfering with critical trip logic.

 


Specific Application

  • Plant-Wide Supervisory Data Scans: Multiplexing static engineering units (e.g., GAP voltages, direct vibration amplitudes, channel statuses, and alarm bits) from up to 14 rack slots into centralized control systems.
  • Multi-Rack Industrial Daisy Chaining: Connecting up to 255 separate 3300 machinery protection racks over a long-distance RS-422 communication trunk-line using master-slave serial architectures.

 


Ordering Information

Component Category

Part / Catalog Number

Official Manual Description

Procurement & Application Specification

Main System Monitor

3300/03-01-00

System Monitor with Serial Data Interface (SDI)

Core Item. Main rack slot 1 interface, configured for static data scans.

Main Processing PCB

87870-01

Serial Data Interface Circuit Board Assembly

Replacement Core. The main motherboard housing RAM, ROM, and protocol headers.

Upgrade Option Kit

104006-01

3300 System SDI/DDI Hardware Upgrade Kit

Required when retrofitting legacy 3300/01 chassis with modern system monitor faceplates.

Firmware Update Kit

104007-01

3300 System SDI/DDI Firmware Upgrade Kit

Used to flash backplane microprocessors to match enhanced Modbus maps.

Standard Host Link

89968

RS-232 Communication Host Signal Cable

Cable Option. Limited to 100 ft max. Links PIM SDI HOST to Honeywell PLC Gateways.

Long-Distance Link

89970

RS-422 Communication Host Signal Cable

Cable Option. Extends range up to 4000 ft. Connects SDI HOST to Allen-Bradley 1770-KF2.

Rack Chassis Link

47125

RS-422 Rack-to-Rack Interconnect Cable

Trunk Cable. Used to link SDI RACK on a primary rack to SDI HOST on a secondary rack.

Verification Package

101209-02

SDI/SI Test Package (3½-inch Diskette Variant)

Optional software framework used to test and validate Modbus address profiles.


System Compatibility

  • System Compatibility: The 3300/03-01-00 resides exclusively within the dedicated System Monitor slot located on the far-left side of a standard 3300 chassis. It integrates with the rack’s Power Input Module (PIM) to route signals through the rear panel SDI HOST and SDI RACK connectors. The onboard firmware provides built-in multi-protocol registers compatible with Allen-Bradley DF1 Full-Duplex and Modicon Modbus protocols, linking into AB 1770-KF2, 1771-KE, or Honeywell PLC Gateways.
  • Direct Application Alternates: 3300/03-02-00 (System Monitor with Dynamic Data Interface / DDI) and 3300/01-02 (Legacy 3300 Serial Interface).
  • Key Differences from Alternates (3300/03-01-00 vs. 3300/03-02-00 / Legacy 3300/01-02):
  • Dynamic Waveform Capability: The 3300/03-01-00 (SDI only) collects strictly static measurements and alarm bits across a 5-second interval loop. The advanced 3300/03-02-00 (DDI) incorporates a secondary processing card (Part 87880-01) that performs synchronous and asynchronous sampling on buffered outputs to stream real-time orbital, time-base, and spectrum waveforms to System 1 or TDM 2 software.
  • Register Layout Mapping: While the 3300/03-01-00 retains backward address compatibility for channel direct values found in the legacy 3300/01-02 module, its Monitor Status memory registers use an entirely modified, enhanced word address footprint. The newer 3300/03-01-00 also introduces advanced features unavailable on the legacy card, including Modbus setpoint value readback, fast trending memory tables, and 6-channel temperature module scanning.

 


Installation & Troubleshooting FAQ

Q1: What strict protocol rule applies to a multi-rack layout when selecting between Allen-Bradley DF1 and Modicon Modbus?

A: Your physical system layout dictates your protocol choice. The Allen-Bradley DF1 protocol operates strictly as a full-duplex point-to-point link, meaning only one single 3300 rack can map per interface module. If your design demands multi-rack integration, you must configure the system for Modicon Modbus protocol, which uses a master-slave topology that supports daisy-chaining multiple racks over RS-422 channels.

Q2: Why must the jumpers on headers W4 and W5 be specifically audited when replacing a standalone SDI circuit board?

A: Headers W4 and W5 on the main 87870-01 board determine the operating mode of the microprocessor. For a standard 3300/03-01-00 (SDI Enabled), you must install a jumper strictly across header W4 and ensure header W5 remains open. If a jumper is mistakenly left on header W5 when no secondary DDI daughterboard is plugged into the assembly, the processor will lock up during boot and trip a major internal software execution fault.

Q3: How do I initiate a hardware Self-Test in the field, and how do I read the internal LED error codes?

A: Loosen the front retaining screws and move the front plate to the left to expose the internal circuit board. Insert a flathead screwdriver to short across the designated self-test header until all 8 internal LEDs light up, then release it. The module will run 7 separate diagnostic routines, turning off corresponding LEDs from the top down. If a test fails, its indicator stays lit and the DATA INTERFACE OK faceplate light turns off. For example, if LED 1 or LED 2 stays on, it signals a terminal RAM or ROM failure, meaning the main SDI board must be replaced.

Q4: What hazardous material handling warning must be observed when disposing of or servicing an old 3300/03 processor card?

A: Every 3300/03 SDI circuit board houses a specialized integrated circuit designated as IC position U12. This specific component contains hermetically sealed metallic lithium to power the nonvolatile memory clocks. You must never break open, crush, or desolder the U12 component while servicing the module. Damaging the casing can expose raw lithium to atmospheric moisture, creating an immediate fire hazard and risking chemical injury to plant personnel.

Q5: Why am I getting periodic packet timeouts or communication drops on the middle racks of a long-distance RS-422 daisy chain?

A: This points to an improper line impedance termination layout across your network. For proper signal balancing, termination jumpers must be installed strictly on the first and the last physical racks in the daisy-chain network. All intermediate units sitting in the middle of the trunk line must have their jumpers completely removed from headers W10 through W13. Leaving termination loops closed on center units dampens the high-frequency line voltage, causing intermittent packet drops across the bus.

Contact information

Please don’t hesitate to contact us if you have any questions or concerns before or after your purchase. We are committed to your 100% satisfaction.

Sales Manager:Stella

Email:sales6@apterpower.com

Whatsapp:+86 18159889985

 


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